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Interconnections: Bridges, Routers, Switches, and Internetworking Protocols (2nd Edition) (Addison-Wesley Professional Computing Series)
Radia Perlman's Interconnections is recognized as a leading text on networking theory and practice It provides authoritative and comprehensive information on general networking concepts, routing algorithms and protocols, addressing, and the mechanics of bridges, routers, switches, and hubs. This Second Edition is expanded and updated to cover the newest developments in the field, including advances in switching and bridge technology, VLANs, Fast Ethernet, DHCP, ATM, and IPv6. Additional new topics include IPX, AppleTalk, and DECnet. You will gain a deeper understanding of the range of solutions possible and find valuable information on protocols for which documentation is not readily available elsewhere. Written by the inventor of many of the algorithms that make switching and routing robust and efficient, Interconnections, Second Edition offers an expert's insight into how and why networks operate as they do. Perlman describes all of the major networking algorithms and protocols in use today in clear and concise terms, while exploring the engineering trade-offs that the different approaches represent. The book contains extensive coverage of such topics as: *The spanning tree algorithm *The differences between bridges, routers, and switches *Virtual LANs (VLANs) and Fast Ethernet *Addressing and packet formats for IP, IPv6, IPX, CLNP, AppleTalk, and DECnet *Autoconfiguration of addresses; strategies in various protocol suites *Routing protocols, including RIP, IS-IS, OSPF, PNNI, NLSP, and BGP *Layer 3 multicast protocols, including IGMP, DVMRP, MOSPF, CBT, PIM, BGMP, Simple Multicast, and Express *Sabotage-proof routing *Protocol design folklore 0201634481B04062001.
Price: $45.95
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When a Butterfly Sneezes: A Guide for Helping Kids Explore Interconnections in Our World Through Favorite Stories (Systems Thinking for Kids, Big and Small, Vol 1)
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Buddhism and Ecology: The Interconnection of Dharma and Deeds (Religions of the World and Ecology)
Given the challenges of the environmental crisis, Buddhism's teaching of the interrelatedness of all life forms may be critical to the recovery of human reciprocity with nature. In this new work, twenty religionists and environmentalists examine Buddhism's understanding of the intricate web of life. In noting the cultural diversity of Buddhism, they highlight aspects of the tradition which may help formulate an effective environmental ethics, citing examples from both Asia and the United States of socially engaged Buddhist projects to protect the environment. The authors explore theoretical and methodological issues and analyze the prospects and problems of using Buddhism as an environmental resource in both theory and practice. This groundbreaking volume inaugurates a larger series examining the religions of the world and their ecological implications which will shape a new field of study involving religious issues, contemporary environmental ethics, and public policy concerns..
Price: $25.00
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Principles and Practices of Interconnection Networks (The Morgan Kaufmann Series in Computer Architecture and Design)
One of the greatest challenges faced by designers of digital systems is optimizing the communication and interconnection between system components. Interconnection networks offer an attractive and economical solution to this communication crisis and are fast becoming pervasive in digital systems. Current trends suggest that this communication bottleneck will be even more problematic when designing future generations of machines. Consequently, the anatomy of an interconnection network router and science of interconnection network design will only grow in importance in the coming years. This book offers a detailed and comprehensive presentation of the basic principles of interconnection network design, clearly illustrating them with numerous examples, chapter exercises, and case studies. It incorporates hardware-level descriptions of concepts, allowing a designer to see all the steps of the process from abstract design to concrete implementation. ·Case studies throughout the book draw on extensive author experience in designing interconnection networks over a period of more than twenty years, providing real world examples of what works, and what doesn't. ·Tightly couples concepts with implementation costs to facilitate a deeper understanding of the tradeoffs in the design of a practical network. ·A set of examples and exercises in every chapter help the reader to fully understand all the implications of every design decision..
Price: $56.99
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Electronic Packaging and Interconnection Handbook
This is the most comprehensive reference in electronic packaging - completely updated. From new materials and technologies to increasingly prevalent lead-free manufacturing practices, "Electronic Packaging and Interconnection Handbook" offers a unique source of key reference data, practical guidance, and circuit and package design basics. Through three best-selling editions, this classic reference has served those involved in the design, manufacture, testing, and use of all types of electronic packaging, becoming the most widely used reference in the industry.This thoroughly revised and expanded Fourth Edition adds new information on key MEMs; optoelectronic, single-chip, and high-speed technologies; and updates important chapters on ball grid array and flip chip technologies. Of interest to mechanical and electrical engineers, chemists, physicists, and materials scientists in all areas of the electronic packaging industry, the book takes a unique interdisciplinary approach to the field, allowing specialists in one area to understand the needs and responsibilities of others. Whether your area of expertise is design and manufacturing, quality control, or marketing, it's easy to see why the Fourth Edition of the "Electronic Packaging and Interconnection Handbook" makes an excellent addition to your reference arsenal.Written by a team of experts from around the globe, this remarkable volume covers all aspects of electronic packaging, including: Materials; Thermal Management Shock, Vibration, and Operational Stress Management; Connector and Interconnection Technologies; Soldering and Cleaning Technologies; Single Chip Packaging and Ball Grid Arrays; Surface Mount Technology; Hybrid and Multichip Modules; Chip-Scale, Flip-Chip, and Direct-Chip Attachment; Rigid and Flexible Printed-Wiring Boards; Packaging High-Speed and Microwave Systems; Packaging High-Voltage Systems; Packaging of MEMs Systems; and, Packaging of Optoelectronic Systems..
Price: $107.69
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Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield
The wire bonding bible - now revised and expanded! Get the practical know-how you need to design and evaluate wire bonds engineered with the latest - and still-evolving- metallurgies Extensively revised and updated, the Second Edition of George Harman's classic Wire Bonding in Microelectronics shows you step-by-step how to exploit new higherm density interconnection techniques and engineer reliable gonds at a very high yield. You get the hands-on guidance you need to test wire bonds...clean bond pads to improve bondability and realiability...solve cratering, heel cracks, bond fatigue, so-called purple plague and other mechanical problems....bond wires to multichip modules...and much, much more. You also get up-to-the-minute details on utilizing fine pitch SMT, applying new bonding metallurgies, and exploring wire sweep and the wire bonding mechanism..
Price: $53.96
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The Competitive Internet Service Provider: Network Architecture, Interconnection, Traffic Engineering and Network Design (Wiley Series on Communications Networking & Distributed Systems)
Due to the dramatic increase in competition over the last few years, it has become more and more important for Internet Service Providers (ISPs) to run an efficient business and offer an adequate Quality of Service. The Competitive Internet Service Provider is a comprehensive guide for those seeking to do just that. Oliver Heckmann approaches the issue from a system point of view, looking not only at running a network, but also at connecting the network with peering and transit partners or planning the expansion of the network. The Competitive Internet Service Provider: - Offers an advanced reference on the topic, drawing on state-of-the art research in network technology.
- Clearly defines the criteria enabling ISPs to operate with the greatest efficiency and deliver adequate Quality of Service.
- Discusses the implications of the future multiservice Internet and multimedia applications such as Voice over IP, peer-to-peer, or network games.
- Delivers a comparative evaluation of different feasible Quality of Service approaches.
- Explores scientific methods such as queuing theory, network calculus, and optimization theory.
- Illustrates concepts throughout with mathematical models and simulations.
This invaluable reference will provide academic and industrial researchers in the field of network and communications technology, graduate students on telecommunications courses, as well as ISP managers, engineers and technicians, equipment manufacturers and consultants, with an understanding of the concepts and issues involved in running a successful ISP..
Price: $98.76
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Service Efficient Network Interconnection via Satellite: EU Cost Action 253
A Local Area Network (LAN) is a network usually within a single office or building that links desktop computers with each other and with peripherals such as servers and printers. The interconnect is the electrical and functional association of two different services, often provided by different suppliers, and it is from LAN inter-connection that telecoms operators seek to profit. The application of LAN interconnection via satellite can be used to complement and extend existing terrestrial public access networks through interconnection of clusters of broadband islands (such as LANs and MANs) in remote regions, where terrestrial lines are expensive to install and operate. Examples include: * Hospitals/clinics in remote and rural areas can be connected to the central hospitals in a tele-medicine environment * Remote offices can be connected to the central office to facilitate tele-working * University/colleges can be inter-connected to provide tele-education facilities Similarly, the possibility to provide access to such facilities in developing regions of the world is also viable and particularly attractive in the short to mid-term. Private LAN connection facilities could also be made available to the corporate user, offering the possibility to establish broadband internet access within a closed user group. Such a scenario could be of interest to the financial sector. By gathering the knowledge and experiences of well-known satellite systems experts from different parts of Europe this comprehensive volume provides detailed analysis on technical aspects for interconnecting local area network using satellite. Starting from traffic source modelling for different types of applications and services to different types of transmission techniques and networking functions for supporting such services, different case studies are presented to analyse the performance of such technologies. By providing an insight to current and future developments in satellite communications systems and by covering a broad range of materials in technical aspects in relation to satellite communication systems technologies, this volume will be of tremendous use to researchers, academia and industry. * First book to present such a thorough description of the reliability functions of satellite systems * Discusses IP over satellite * Provides a unique analysis and description of different simulation tools that are under development for evaluating the performance of satellite systems * Includes a chapter devoted to traffic modelling for satellite systems * Reviews current research and developments in security and discusses how such security functions can be implemented over satellite networks * Addresses different types of routing strategies and includes three different case studies which have been carried out to analyse the performance of different routing strategies.
Price: $31.59
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Multichip Module Design, Fabrication, and Testing (Electronic Packaging and Interconnection)
The advent of multichip modules (MCMs) is revolutionizing the ways in which electronic systems and equipment are designed, tested, and manufactured. This new, still evolving technology for packaging printed circuit boards (PCBs) is commanding intense interest and excitement. Now one of its pioneers has written the first book that not only describes MCM technology, but also shows designers how to use it in practice. This groundbreaking, hands-on guide covers such practical issues as electronics testing, rework procedures, and failure modes and mechanisms..
Price: $7.65
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