Books about Substrate from Amazon.com

Catch All Book. Full Color Pictures. Variety of Arachnids Cover.
Price: $8.35 [Notify me when price goes down.]

With expanded and updated information including current techniques, approaches, and case studies, the 2nd edition of this bestselling book continues its reputation as a dependable and outstanding evidence-based source on acquired motor speech disorders in adults. It covers the substrates of motor speech and its disorders, the disorders and their diagnoses, and management -- focusing on integrating what is known about the bases of motor speech disorders with the realities of clinical practice to ensure readers have the key content they need to be effective practitioners.

• Evidence-based practice focus with relevant research evidence and data from the Mayo Clinic speech pathology practice
• Includes the clinical characteristics of the primary motor speech disorders as well as general guidelines for differential diagnosis
• Offers authoritative guidance on the diagnosis and management of motor speech disorders by a highly respected expert in the field of motor speech disorders
• 73 case studies demonstrate concepts as they apply to real-world practice
• Over 100 table and boxes highlight important information

• Chapters include new research and theories, new techniques, current trends, and updated and new information sources
• 22 new illustrations showcase the latest technology in the field
• Fresh, new book design highlights case studies, boxed text, and tables - making it easier to find key information
• Nine new case studies reflect the realities of clinical practice today

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Price: $60.17 [Notify me when price goes down.]

Electrodeposition allows the "tailoring" of surface properties of a bulk material or, in the case of electroforming, the entire part. Deposits can be produced to meet a variety of designer demands. For this reason and for the possibilities that exist in terms of "new materials" for a variety of applications, a thorough understanding of the materials science of electrodeposition is of utmost importance. This book provides that understanding..
Price: $90.00 [Notify me when price goes down.]

This introductory ecology lab manual focuses on the process of collecting, recording and analyzing data, and equips students with the tools they need to function in more advanced science courses. It reflects the most current techniques for data gathering so that students can obtain the most accurate samples. Balanced coverage of plant, animal and physical elements offers a diverse range of exercises. Includes exercise on writing research reports..
Price: $35.00 [Notify me when price goes down.]

Substrate Noise Coupling in RFICs addresses substrate noise coupling in RF and mixed signal ICs when used in a system on chip (SoC) containing digital ICs as well. This trend of integrating RF, mixed signal ICs with large digital ICs is found in many of today's commercial ICs such as single chip Wi-Fi or Bluetooth solutions and is expected to grow rapidly in the future. The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs. This is particularly critical when process feature sizes scale down to the nano meter range. Substrate Noise Coupling in RFICs reports silicon measurements, new test and noise isolation structures as well as calibration of a design flow used in the design and debug phases of RFICs. A design guide is articulated to be used by RFIC designers to maximize signal isolation and optimize chip floor plan, power and ground domains. Industrial examples of RFICs are given as demonstration vehicles to validate the proposed techniques. Some emphasis is put on the design of on-chip spiral inductors and the impact of the substrate on their performance. To our knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC..
Price: $101.00 [Notify me when price goes down.]

World Dependencies:Oil and energy, climate, food, medicine ..

There is an even greater dependency that goes ignored: on semiconductor materials -- substrates such as silicon -- that are the basis for all the integrated circuits and chips used around the world. Substrates are the foundation to the digital revolution, commerce in the 21st century, the Internet, global communications, and of course, defense systems.

When rumors start to appear regarding the fallibility of chips, a young university scientist, expert in semiconductor materials, stumbles upon an aberrant, time-delayed behavior in substrates. The magnitude of the aberration could impact the functioning of chips across the globe. That such a problem could exist is absurd. He doubts it. His colleagues doubt it. If he were to verify the rumors, would the results be worldwide panic?

Sensitive to a fault with his family yet pragmatic in his research, he struggles to perfect an unimaginable solution -- one that must be implemented rapidly with the aid of his colleagues. To develop a solution in the lab based solely upon mathematics and the hypothetical behavior of matter seems almost impossible. To implement that technology in a world sliding backwards is an altogether different and even greater challenge. He must fight errant bloggers and journalists, maverick federal agents, a semiconductor cartel, all of whom threaten his family, his life, his faith in God.

Through his wife's love he finds strength and a renewal in his own faith to overcome the technical challenges, intrigue, and doubts. Overcoming doubt is one thing; timing is another, and the clock is ticking...

High-tech intrigue mixes with human nature -- greed, love, doubt, faith -- to make this a story that must be told: a thrilling twist to what we assume is true..
Price: $15.00 [Notify me when price goes down.]

• A guided tour through the new generation of high-performance printed circuit boards (PCBs) and ceramic substrates
• Packed with leading-edge information, including data, details and guidelines on microvias, built-up multi-layers, high-density boards, and advanced ceramic substrates
• Covers environmentally safe PCB materials and processes
• Essential for electronics engineers, designers, and technicians--plus manufacturing and mechanical engineers

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Price: $78.85 [Notify me when price goes down.]

This is a book for semiconductor design engineers working on analog and mixed-signal integrated circuits; however, it also contains useful information for package, printed circuit board, and system designers. The book provides a practical approach to the analysis of noise coupling mechanisms, the implementation of suppression techniques, and the simulation using modeling and extraction tools. The overall goal is to improve the technical skills of designers, enabling them to better understand and solve the continuously aggravating noise coupling issues. Chapters 1 and 2 discuss fundamental concepts governing noise coupling mechanisms and present an overview of integrated circuits fabrication technology. Chapters 3, 4, and 5 focus on understanding the physical mechanisms that govern the noise coupling in integrated circuits. Noise generation, propagation and reception are analyzed at the device structure, chip, package, and PCB levels. Chapter 6 focuses on measuring the noise coupling in integrated circuits. Various techniques are presented, and advantages and disadvantages are discussed. A novel technique using differential sensors for power and substrate noise and an on-chip waveform digitizer is also presented. Chapter 7 focuses on suppressing the noise coupling in integrated circuits. Advantages, disadvantages, and limitations of various techniques are presented with relation to the physical structures of devices and substrate. Two design examples of circuit level compensation techniques and experimental results are also presented. Chapter 8 focuses on modeling and simulating the noise coupling in integrated circuits. The selection of conventional methods and tools is discussed, highlighting the advantages and limitations specific to various stages of the design flow. A practical modeling technique based only on information available in the architectural definition stages of projects is also presented..
Price: $159.00 [Notify me when price goes down.]

A huge revolution is emerging in the format and manufacturing process of electronic devices including displays brought on by the use of plastic substrates and printing technology. Flexible substrates enable large displays that can be freely bent, lightweight, and easily transported, as a result. In addition, the new technology has the potential of achieving various new devices such as e-paper, a new display medium, which epitomizes the advantage of hard copy paper; solar cells which are 1/10 the weight; sensors that can be completely embedded in floors and personal clothing.This report analyzes the latest trends in the technology and materials surrounding the manufacturing process of flexible electronic devices, with the above exciting breakthrough features..
Price: $99.00 [Notify me when price goes down.]